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HyTemp®-Based Adhesives

HyTemp ACM


Adhesive, Caulk & Sealant Applications

ZEON Products: 4051CG, 4451CG, 4454

HyTemp Adhesives Brochure (PDF)

Application Description:

Inherently tacky HyTemp is the ideal additive for adhesive, caulk, and sealant applications, providing advanced qualities such as better flow, improved adhesion properties, low-temperature functionality, and heat, oil, fuel, and chemical resistance. HyTemp maintains its strength in elevated temperatures and shows no air, ozone, sunlight, or heat degradation. Aside from its hallmark resistance to high temperatures, HyTemp also has great flexibility retention and improved bonding in low temperatures.

Pressure Sensitive Adhesives (PSAs) HyTemp elastomers are used to make high-performance PSAs for holding a wide variety of substrates. Preferred by the automotive industry for attaching protective moldings, bumper strips, identification plates, etc., these PSAs have excellent heat and chemical resistance as well as better aging characteristics than other elastomer-based PSAs.

Advantages of Using HyTemp PSA’s

  • No air, ozone, sunlight, or heat degradation
  • Strength in elevated temperatures
  • Flexibility retention and improved bonding in low temperatures
  • Oil, fuel, and chemical resistance
  • Resists PVC plasticizer migration
  • Improved adhesion to metals, plastics and other substrates

Hot Melt Adhesives (HMAs) HyTemp-based HMAs are high-melting-temperature adhesives with creep resistance under 200°F.

Hot Melt Pressure Sensitive Adhesives (HMPSAs) HMPSAs are geared for high-performance tapes and specialty end-uses such as interior carpet and lamination in automotive applications. HyTemp HMPSAs have better thermal, oxidative, and UV stability than both HMAs and PSAs.

Sealant Caulks HyTemp Caulks are solvent-based and 100% solids hot-melt-type sealant caulks. These caulks provide excellent oxidation resistance and are of a more subtle clear color.

Sealant Tapes HyTemp has a unique property allowing it to accept high loadings of fillers. In fact, several applications have been developed where filler levels have exceeded 600 parts. This coupled with oil, chemical, and oxidation (ozone) resistance, make HyTemp sealant tape particularly well-suited for underground, electrical applications. Plasticity and peel strength can vary depending upon the level of fillers, resins, and liquid plasticizers incorporated in the formulation.

Solution Viscosities

Although it may be milled to lower its viscosity, HyTemp requires no milling prior to mixing. Cement grade HyTemp ACM has a relatively lower molecular weight and is designed to be directly soluble, without gelling, in MEK, toluene, and other solvents.